PCB holim'a kalafo ke senotlolo le motheo oa boleng ba patch ea SMT.Ts'ebetso ea kalafo ea sehokelo sena haholo-holo e kenyelletsa lintlha tse latelang.Kajeno, ke tla arolelana le uena phihlelo ea bopaki ba boto ea potoloho le uena:
(1) Ntle le ENG, botenya ba lesela la plating ha bo hlalosoe ka ho hlaka ho litekanyetso tsa naha tsa PC.E hlokahala feela ho fihlela litlhoko tsa solderability.Litlhoko tse akaretsang tsa indasteri ke tse latelang.
OSP: 0.15 ~ 0.5 μm, e sa hlalosoang ke IPC.E khothalletsoa ho sebelisa 0.3 ~ 0.4um
EING: Ni-3～5um;Au-0.05～0.20um (PC e bolela feela tlhoko ea ha joale ea thinnest)
Im-Ag: 0.05 ~ 0.20um, ha e le motenya, ha kutu e matla le ho feta (PC ha e hlalosoe)
Im-Sn: ≥0.08um.Lebaka la ho ba motenya ke hore Sn le Cu li tla tsoela pele ho fetoha CuSn ka mocheso oa kamore, e amang solderability.
HASL Sn63Pb37 ka kakaretso e entsoe ka tlhaho lipakeng tsa 1 le 25um.Ho thata ho laola ka nepo mokhoa ona.E senang lead haholo-holo e sebelisa motsoako oa SnCu.Ka lebaka la mocheso o phahameng oa ts'ebetso, ho bonolo ho theha Cu3Sn e nang le molumo o fokolang oa molumo, 'me ha e sebelisoe hona joale.
(2) The wettability ho SAC387 (ho ea ka nako ea ho koloba tlas'a linako tse fapaneng tsa ho futhumatsa, yuniti: s).
0 linako: im-sn (2) florida botsofali (1.2), osp (1.2) im-ag (3).
Zweiter PLENAR SESSION Zweiter PLENAR SESSION Im-Sn e na le khanyetso e ntle ka ho fetisisa ea kutu, empa khanyetso ea eona ea solder e fokola haholo!
Linako tse 4: ENG (3)-ImAg (4.3)-OSP (10)-ImSn (10).
(3) Ho koloba ho SAC305 (kamora ho feta seboping habeli).
SESOTHO (5.1)—Im-Ag (4.5)—Im-Sn (1.5)—OSP (0.3).
Ebile, batho ba sa rutehang ba kanna ba ferekanngoa haholo le maemo ana a profeshenale, empa e tlameha ho hlokomeloa ke baetsi ba bopaki ba PCB le patching.
Nako ea poso: May-28-2021
