W25Q64JVSSIQ Non-Volatile FLASH 64Mb (8M x 8) SPI – Dual/Quad I/O SOP-8_208mil NOR FLASH RoHS

Tlhaloso e Khutšoanyane:

Setšoantšo sa W25Q64JVSSIQ

Moetsi: Winbond

Sephutheloana: SMD

Tlhaloso: NOR Flash spiFlash, 64M-bit, 4Kb Uniform Sector

Datasheet: Ka kopo ikopanye le rona.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Parameter ea sehlahisoa

Litlhaloso
Tšobotsi	Boleng
Moetsi:	Winbond
Sehlopha sa Sehlahisoa:	NOR Flash
RoHS:	Lintlha
Mounting Style:	SMD/SMT
Sephutheloana / Taba:	SOIC-8
Letoto:	W25Q64JV
Boholo ba memori:	64 Mbit
Supply Voltage - Min:	2.7 V
Supply Voltage - Max:	3.6 V
Ho Bala Hona Jwale - Max:	25 mA
Mofuta oa Sehokelo:	SPI
Boholo ba Nako ea Oache:	133 MHz
Mokhatlo:	8 mx8
Bophara ba Bese ea Data:	8 hanyane
Mofuta oa Nako:	E lumellana
Mocheso o fokolang oa ho sebetsa:	- 40 C
Boholo ba Thempereichara ea Tšebetso:	+ 85 C
Sephutheloana:	Terei
Lebitso:	Winbond
Thepa ea Hona Joale - Max:	25 mA
Ha e Mamelle Mongobo:	Ee
Mofuta oa Sehlahisoa:	NOR Flash
Bongata ba Pakete ea Feme:	630
Sehlopha-potlana:	Memori & Polokelo ea Boitsebiso
Lebitso la khoebo:	SpiFlash
Boima ba Yuniti:	0.006349 oz

Lintlha tsa Sehlahisoa

Likaroloana:
* Lelapa le Lecha la Mehopolo ea SpiFlash - W25Q64JV: 64M-bit / 8M-byte
- SPI e tloaelehileng: CLK, /CS, DI, DO
- Dual SPI: CLK, /CS, IO0, IO1
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1)
* Ts'ebetso ea serial Flash e phahameng ka ho fetesisa
- 133MHz lioache tse le 'ngoe, tse Dual/Quad SPI
266/532MHz e lekanang le Dual/Quad SPI
– Min.100K Program-Erase cycles per sector - Ho feta lilemo tse 20 tsa ho boloka data
* "Ho Bala ho Tsoelang Pele" e sebetsang hantle
- Bala ka ho Tsoela Pele ka 8/16/32/64-Byte Wrap - Lioache tse ka bang 8 ho sebetsana le mohopolo
- E lumella ts'ebetso ea 'nete ea XIP (etsa sebakeng) - E Feta X16 Parallel Flash
* Matla a Tlase, Mocheso o Pharalletseng oa Mocheso - Single 2.7 ho 3.6V phepelo
- <1μA Matla a tlase (mofuta.)
-40°C ho ea ho +85°C sebaka sa tšebetso
* Meaho e bonolo e nang le likarolo tsa 4KB
- Sekhahla se sa Tšoaneng / Thibelo ea Thibelo (4K/32K/64K-Byte) - Lenaneo la 1 ho isa ho 256 byte leqepheng le leng le le leng le ka khonehang - Hlakola / Lenaneo Emisa 'me U qale hape
* Likarolo tsa Ts'ireletso tse tsoetseng pele
– Software le Hardware Ngola-Sireletsa
- Tšireletso e khethehileng ea OTP(1)
- Holimo / Tlase, Tšireletso e tlatsetsang - Tšireletso ea motho ka mong / Sehlopha sa tšireletso
- 64-Bit ID e ikhethang bakeng sa sesebelisoa ka seng
- Ngoliso ea Li-Parameters tse Fumanehang (SFDP) - Lingoliloeng tsa Ts'ireletso tsa 3X256-Bytes
- Li-Bits tsa Ngoliso ea Boemo bo sa fetoheng le bo sa fetoheng
* Packaging e sebetsang hantle sebakeng
– 8-pin SOIC 208-mil / VSOP 208-mil
– 8-pad WSON 6x5-mm/8x6-mm, XSON 4x4-mm – 16-pin SOIC 300-mil
- 8-pin PDIP 300-mil
- Libolo tse 24 TFBGA 8x6-mm (6x4 bolo ea lihlopha)
- Libolo tse 24 TFBGA 8x6-mm (6x4/5x5 bolo ea sehlopha)
- Ikopanye le Winbond bakeng sa KGD le likhetho tse ling